Universal Laser Systems | Laser Cutting, Engraving & Marking

Universal Laser Systems laser cutting, engraving and marking systems

Advanced Laser Material Processing Technology

Universal Laser Systems (ULS) develops configurable laser material processing systems for cutting, engraving, marking, prototyping, research, and manufacturing. Its modular platforms combine precision laser technology, advanced software, and application-specific configuration options to process a broad range of traditional and advanced materials.

From compact desktop systems to advanced multi-wavelength platforms, ULS solutions can be configured around the material, application, processing area, laser wavelength, power requirements, and workflow of the user. This flexibility makes Universal Laser Systems well suited for technical education, engineering and research laboratories, prototyping, product development, and advanced manufacturing applications.

Current Universal Laser Systems Platforms

  • ULTRA X6000 – advanced multi-wavelength laser material processing for demanding research, prototyping, and manufacturing applications
  • ULTRA R9000 – large-format configurable laser processing with CO2 and fiber laser options
  • ULTRA R5000 – flexible precision laser processing in a compact ULTRA platform
  • VLS3.60ES – desktop laser material processing with modern Laser System Manager software
  • VLS and PLS Platforms – versatile systems for cutting, engraving, marking, and related material-processing applications

Universal Laser Technology & Features

Features and configuration options vary by platform. Universal Laser Systems combines advanced software, modular laser sources, precision optics, intelligent material processing, and automation technologies to support a wide range of applications.

Current ULTRA systems and the VLS3.60ES use Universal's Laser System Manager (LSM), an advanced software environment for managing design files and laser-processing parameters. The Intelligent Materials Database helps users establish processing settings based on the material and the specific laser-system configuration.

When a supported system configuration changes, the database can recalculate processing parameters, helping simplify setup and improve consistency across a wide range of materials.

Supported ULS platforms can be configured with different laser wavelengths and power levels to match specific material-processing requirements. Available technologies include 10.6 µm and 9.3 µm CO2 lasers and, on supported platforms, 1.06 µm fiber lasers.

Universal's patented Rapid Reconfiguration™ technology allows compatible CO2 laser sources to be installed or reinstalled without requiring field optical alignment, helping a system adapt to changing applications and materials.

On supported ULTRA platforms, Multi-Wave Hybrid™ technology allows multiple laser wavelengths to be used individually, sequentially, or in combination. Matching laser energy to the absorption characteristics of a material can expand processing capabilities for polymers, composites, metals, multilayer materials, and other challenging applications.

Available on select ULTRA systems, Multi-Camera Vision and Registration helps users accurately position designs relative to the material being processed. The system can display the design over an image of the material, allowing the operator to position, rotate, and scale artwork with real-time visual feedback.

SuperSpeed™ technology uses two independently controlled laser beams to process two raster lines simultaneously. On supported dual-CO2-laser configurations, this can significantly increase effective raster-processing speed while the beams can also be combined for vector processing.

Advanced ULTRA platforms feature Precision Material Independent Autofocus to establish accurate focus without relying on assumptions about the optical properties of the material.

Patented Controllable Laser Power Density technology provides additional control over the concentration of laser energy at the material surface, allowing the system to be configured for applications ranging from larger-area processing to fine, detailed work.

Supported ULS systems can include programmable gas assist, automation interfaces, optics protection, and other workflow-integration technologies. These capabilities help users optimize processing conditions and integrate laser material processing into research, prototyping, and production environments.

1-Touch Laser Photo™ converts digital photographs into optimized bitmap images for laser engraving and marking. The software applies image-processing techniques based on the selected material to help produce detailed photographic engravings with less trial-and-error setup.

*Features and configuration options vary by Universal Laser Systems platform and laser configuration.

Why Universal Laser Systems?

  • Laser cutting, engraving, marking, and precision material processing
  • CO2 and fiber laser technologies on supported platforms
  • Configurable systems for a broad range of materials and applications
  • Advanced material-processing software and intelligent parameter selection
  • Solutions for education, engineering, research and development, prototyping, and manufacturing
  • Modular architecture that can adapt to current and future processing requirements

Creating Opportunities with Digital Laser Material Processing Technology

Learn More About Universal Laser Systems

Please fill out the form to request a quote or learn more about Universal Laser Systems for your education, research, prototyping, or manufacturing application.